Millimeter-wave and sub-THz Integrated Systems
There is a vast amount of spectrum available at the upper millimeter and sub-mm-wave frequencies. We are interested in developing front-end integrated circuits that can transmit and receive at such carrier frequencies. The goal of this research is to construct circuits and systems on silicon that enable short-range to mid-range line-of-sight communication. Such hardware frontends are applicable to cable free last-mile broadband internet as well as backbone links for broadband internet access to distant areas.
Large-scale Scalable Phased Arrays
Large-scale regular and sparse arrays are crucial for long-range communication links and distributed sensing. Such systems are difficult to construct using a central control such as a tree distribution. We aim to construct truly scalable networks of coupled oscillators and transceivers. This project will provide the technology to implements thousands of elements in an array both within a single chip and across multiple chips. The outcome of this research will assist in overcoming the fundamental power limits of the individual devices toward Terahertz transceivers and distributed radars.
Millimeter-wave Integrated Electromagnetic Sensing
Sensing and radar-based imaging at mm-wave and sub-THz frequencies has two important benefits: First, the wide bandwidth provides sub-cm 3D imaging and enables visibility through optically opaque objects. Second, spectroscopy at Terahertz enables material detection with a high level of specificity. Such sensing is beneficial for many industries including self-driving automotives, security, and agriculture inspection. In this research, we develop such low-cost and low profile integrated sensors for sensor networks and imaging arrays.